Towards package opening detection at power-up by monitoring thermal dissipation

Pascal Nouet; Frédérick Mailly; Julien Toulemont; Geoffrey Chancel; Philippe Maurine

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Towards package opening detection at power-up by monitoring thermal dissipation

Working paper

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Towards package opening detection at power-up by monitoring thermal dissipation

Pascal Nouet, Frédérick Mailly, Julien Toulemont, Geoffrey Chancel and Philippe Maurine

Abstract

Security

Fault attacks

Coutermeasurs

Hardware

Reverse-engineering

Countermeasure

Thermal dissipation monitoring

Among the various threats to secure ICs, many are semi-invasive in the sense that their application requires the removal of the package to gain access to either the front or back of the target IC. Despite this stringent application requirements, little attention is paid to embedded techniques aiming at checking the package's integrity. This paper explores the feasibility of verifying the package integrity of microcontrollers by examining their thermal dissipation capability.

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Title: Towards package opening detection at power-up by monitoring thermal dissipation
Creators - without role: Pascal Nouet - Smart Integrated Electronic Systems
Frédérick Mailly - Smart Integrated Electronic Systems
Julien Toulemont - Smart Integrated Electronic Systems
Geoffrey Chancel - Smart Integrated Electronic Systems
Philippe Maurine - Smart Integrated Electronic Systems
Identifiers: 9944474009311
Academic Unit: Laboratoire d'Informatique de Robotique et de Microélectronique de Mtp - LIRMM
Language: English
Resource Type: Working paper
Local Fields: lirmm-04703369