Résumé
Secure integrated circuits are vulnerable to numerous threats and attacks throughout their lifespan. A noticeable group of these threats is semi-invasive attacks that necessitate removing the package, either from the front or the back. To the best of our knowledge, there has been little research focusing on verifying the package integrity. This paper presents an affordable solution for verifying the package integrity at power-up. This solution relies on an indirect and built-in measurement of the IC’s heat dissipation characteristics, taking advantage of the use of thermal sensors embedded in today’s ICs.