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Rheological and thermal study of the curing process of a cycloaliphatic epoxy resin: application to the optimization of the ultimate thermomechanical and electrical properties
Journal article   Open access   Peer reviewed

Rheological and thermal study of the curing process of a cycloaliphatic epoxy resin: application to the optimization of the ultimate thermomechanical and electrical properties

Blanca Palomo Losada, Amelia Habas-Ulloa, Pascal Pignolet, Nicolas Quentin, Daniel Fellmann and Jean-Pierre Habas
Journal of Physics D: Applied Physics, Vol.46(6)
13/02/2013

Abstract

DIFFERENTIAL SCANNING CALORIMETRY DIELECTRIC-BREAKDOWN CURE KINETICS GEL POINT SYSTEM THICKNESS POLYMER SPECTROSCOPY INSULATION ANHYDRIDE
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