"Post-etch cleaning for porous low k integration : impact of HF wet etch on "pore sealing" and "k recovery""

Journal article

Peer reviewed

L. Broussous, W. Puyrenier, D. Rebiscoul, V. Rouessac and A. Ayral

Proceedings of the IEEE, pp.87-89

2008

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Title: "Post-etch cleaning for porous low k integration : impact of HF wet etch on "pore sealing" and "k recovery""
Creators - without role: L. Broussous - STMicroelectronics
W. Puyrenier - STMicroelectronics
D. Rebiscoul - CEA LETI
V. Rouessac - Université de Montpellier, Institut Européen des Membranes - IEM
A. Ayral - Université de Montpellier, Institut Européen des Membranes - IEM
Publication Details: Proceedings of the IEEE, pp.87-89
Identifiers: 9943122409311
Academic Unit: Institut Européen des Membranes - IEM
Language: English
Resource Type: Journal article
Local Fields: hal-00335650