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"Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process"
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"Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process"

L. Broussous, W. Puyrenier, D. Rebiscoul, V. Rouessac et A. Ayral
Microelectronic Engineering, Vol.84, pp.2600-2605
2007

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