Abstract
The degree of curing of epoxy composites and coatings is one key parameter to control the reliability of manufacturing processes, particularly in printed circuit board (PCB) manufacturing where epoxy buildup composites are partially cured before processing. We show that the reaction of curing of an industrially relevant buildup composite (epoxy-phenol reinforced with silica fillers) can be monitored by diffuse reflectance infrared Fourier transform (DRIFT) in the near-infrared range. The accuracy of DRIFT measurements is confirmed by comparison with measurements in transmission mode on reference composite samples. DRIFT is demonstrated to offer an easy and reliable measurement of the epoxy degree of curing on PCB coupons.