Abstract
Despite an abundant literature on epoxy-amine systems, a complete description of the curing kinetics in epoxy-phenol composites was still lacking. In this study, the curing kinetics of an epoxy-phenol composite relevant to microelectronics industry is probed by isothermal and non-isothermal differential scanning calorimetry. An isoconversional analysis of the data reveals a significant contribution of the diffusion of molecular species to the activation energy, at low temperature and high degrees of curing. A model-fitting of the kinetics is performed in two successive steps: high-temperatures data are fitted with Arrhenius law and nth order autocatalytic model (where the diffusion contribution is neglected), whereas low-temperature data are fitted using Rabinowitch and modified-Williams-Landel-Ferry models (considering a diffusion contribution related to the glass transition). The chemical and diffusion contributions to the rate constants are calculated at various temperatures, clarifying the kinetics regimes with precision. Finally, the kinetics regimes are summarized in an improved time-temperature-transformation diagram.