Logo image
Sign in
DFT Simulation of XPS Reveals Cu/Epoxy Polymer Interfacial Bonding
Journal article   Open access   Peer reviewed

DFT Simulation of XPS Reveals Cu/Epoxy Polymer Interfacial Bonding

Thomas Duguet, Andreas Gavrielides, Jérôme Esvan, Tzonka Mineva and Corinne Lacaze-Dufaure
Journal of Physical Chemistry C, Vol.123(51), pp.30917-30925
2019

Abstract

Adsoprtion Metallization DFT XPS
url
Find in HALView

Metrics

1 Record Views

Details

Logo image