Résumé
So far, the test of integrated circuits and systems at wafer level relies on a physical contact between the test equipment and the devices under test on the wafer. This contact-based method is limited by several factors, such as the number of devices tested in parallel, the reduction of the size and the pitch of the bond pads, the number of touchdowns before bond pads are damaged, the cost of the test operations, among others. To overcome these limitations, we explored an alternative test method based on wireless communication. For that, a dedicated wireless test interface was developed. This interface, called Wireless Test Control Block (WTCB) should be integrated within each device under test (DUT). This innovative solution, entirely developed in my thesis, allows the tester to broadcast the test data to all DUT on the wafer, and each DUT to return its response to the tester as well. Finally, a prototype of our WTCB was realized on a reconfigurable platform and allowed us to validate its operation by testing a commercial circuit.