Résumé
In a strongly competitive industrial context, system manufacturers are looking for new technologies for production cost reduction. In particular, recent trends in microelectronic techniques offer the possibility to economically integrate both electronic and mechanical parts on a single chip. The "Front Side Bulk Micromachining" (FSBM) etching technique is now available for fabrication of microstructures on CMOS processed dies. At this time, only few applications using the deformation of FSBM structures are identified.<br />The work presented in this thesis aims at developing methods for the FSBM technology characterization and more generally for the design of MEMS.<br />An experimental study of a so called "cantilever U-Shape" test structure is presented. This characterization permits to extract the mechanical parameters of technology, which are unknown in the microelectronic application field.<br />To give simulation tools to MEMS designers, FSBM cantilever modeling is proposed. This approach uses theoretical results established for composite beams. An Analog VHDL description of the cantilever shows it's possible to integrate mechanical parts within the standard microelectronic design flow.<br />Using both experimental results and models, the "U-Shape" cantilever structure actuated by Lorentz force is evaluated for magnetic field measurement applications.<br />Others magnetic field sensors using beams are finally proposed for further research