Abstract
This thesis is dealing with the challenging preparation and integration of porous dielectric materials with ultra low permittivity (ULK) for interconnections in microelectronic devices. This study focuses on synthesis of hydrophobic ULK thin layers with ordered and isolated porosity obtained by sol-gel. An improvement in mechanical properties and a decrease of the impurities migration in the heart of the bulk are expected. Hydrophobic and mesostructured ULK (k < 2.2) materials have been obtained by sol-gel after removal of porogen mesophases by thermal treatment and for the first time under UV irradiation. Mesostructural and microstructural properties of the layers were discussed with regard to the porosity and mechanical properties. The electrical and gas permeation measurements were also discussed in the framework of their possible applications as ULK materials and gas separation membranes, respectively. Using PECVD, styrene-based polymers, have been synthesized and also characterized in terms of mechanical and gas separation properties.