Abstract
Fault injection techniques have been extensively developed and studied in the past decades. Variousapproaches have emerged, using different physical quantities' manipulation to disturb integrated circuitsbehavior, such as electromagnetic fields to create parasitic currents in the IC targets, also knownas electromagnetic fault injection. Additionally, light emission with the use of laser, leveraging thesilicon photoelectric effect, also known as laser fault injection. Then, simple power supply voltageor clock signal manipulations, enabling to run integrated circuits outside their specifications, thusprovoking exploitable unexpected behavior, known as glitch fault injection. Eventually, biasing thesubstrate of integrated circuits with the help of fast high-voltage pulses, known as body biasing injection,not to cite them all. Among these methods, laser fault injection, electromagnetic fault injectionor glitch fault injection were extensively studied. Therefore, countermeasures allowing to protectand secure integrated circuits were proposed for most of them. However, body biasing injection didnot get this attention. Consequently, no specific countermeasure or understanding of this techniquewere highlighted.In this context, my thesis' work brings some answers and insights concerning body biasing injection.I propose various enhancements of the state-of-the-art way of practicing body biasing injection,thus enabling more repeatable and more reliable experiments. Subsequently, I demonstrate the feasibility,thanks to body biasing injection, of a differential fault attack relying on a constraining single-bitfault model. Then, I introduce a new modeling and simulation flow dedicated to the study of bodybiasing injection. This methodology, based on previous works on electromagnetic fault injection,allows understanding the effect of body biasing injection on integrated circuits, going from electriccharge behavior, to logic gates disturbance and a fault model. Eventually, I present the study ofthe interest in thinning the substrate of integrated circuits for the practice of body biasing injection,illustrating the consequences of such a practice on the efficiency of this fault injection method.