Résumé
For non-critical applications, consumer electronics requires more and more sensing components such as pressure sensors, accelerometers, magnetometers, flowmeters, microphones... Generally, each of these sensors is manufactured with a dedicated technology that involves specific materials and process flows together with either surface or bulk micromachining. The final multi-sensor system is then assembled on a PCB resulting in high manufacturing cost. In this paper, we propose an alternative where various MEMS-based sensors may be fabricated by direct bulk micromachining of the passive silicon substrate used for System-In-Package integration