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Thermal issues in test: An overview of the significant aspects and industrial practice
Acte de colloque

Thermal issues in test: An overview of the significant aspects and industrial practice

Juergen Alt, Paolo Bernardi, Alberto Bosio, Ricardo Cantoro, Hans Kerkhoff, Andreas Leininger, Wolfgang Molzer, Allessandro Motta, Christian Pacha, Alberto Pagani, …
IEEE 34th VLSI Test Symposium
VTS: VLSI Test Symposium (Las Vegas, NV, United States, 25/04/2016–27/04/2016)
23/05/2016
DOI: https://doi.org/10.1109/VTS.2016.7477278

Résumé

Very large scale integration Switches Temperature measurement Temperature distribution Estimation Thermal resistance
Thermal phenomena occurring along test execution at the final stages of the manufacturing flow are considered as a significant issue for several reasons, including dramatic effects like circuit damage that is leading to yield loss. This paper tries to redeem those bad guys in order to exploit them to improve the test quality, reducing the overall test cost without affecting the yield.

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