Résumé
Low frequency noise measurements on ungated MESFET with and without a recess are presented. The study of associated TLM test structures shows that the excess contact noise is negligible compared to the volume noise. On recessed MESFET a significant increase of the noise components is observed, in particular for the g-r process. The origin of the g-r noise is discussed in terms of a surface effect compared to a bulk effect. Also measurements versus temperature and under illumination are presented, pointing out surface damage due to the etch process.