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Strain effects in device processing of silicon-on-insulator materials
Acte de colloque

Strain effects in device processing of silicon-on-insulator materials

Jean Camassel et Antoine Tiberj
APPLIED SURFACE SCIENCE, Vol.212, pp.742-748
11th International Conference on Solid Films and Surfaces (ICSFE-11) (MARSEILLE (FRANCE), France, 08/07/2002)
2003

Résumé

bonded silicon-on-insulator processing SiO2 Si3N4 THERMAL-OXIDATION STRESS SOI INTERFACE LEAKAGE SI
Reporting on residual strain in silicon-on-insulator (SOI) materials we show that multi-insulating layer structures, in which silicon dioxide and silicon nitride are mixed with appropriate thicknesses, can lead to a new family of strain-free materials. This reduces only the original strain and, of course, does not significantly modify any process-induced effect. However, after proper annealing, this should help coming back to a better relaxation level. (C) 2003 Elsevier Science B.V. All rights reserved.

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