Logo image
Se connecter
Strain and wafer curvature of 3C-SiC films on silicon : influence of the growth conditions
Acte de colloque

Strain and wafer curvature of 3C-SiC films on silicon : influence of the growth conditions

Marcin Zielinski, S. Ndiaye, Thierry Chassagne, Sandrine Juillaguet, Renata Lewandowska, Marc Portail, André Leycuras et Jean Camassel
Physica status solidi. A, Applications and materials science, Vol.204(4), pp.981-986
International Workshop on Expert Evaluation & Control of Compound Semiconductor Materials & Technologies (EXMATEC'06) No8 (Cádiz, Spain, 15/05/2006–17/05/2006)
2007

Résumé

Bond order wave Silicon carbides Tensile stress Fabrication property relation Compressive stress Photoluminescence Creep Optical properties Curvature

Fichiers et liens (1)

url
Find in HALAfficher

Indicateurs

1 Consultations de la notice

Détails

Logo image