Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation

Abhishek Koneru; Aida Todri-Sanial; Krishnendu Chakrabarty

doi:10.1109/ICECS.2018.8617951

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Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation

Abhishek Koneru, Aida Todri-Sanial et Krishnendu Chakrabarty

25th IEEE International Conference on Electronics Circuits and Systems (ICECS 2018), pp.217-220

25th IEEE International Conference on Electronics Circuits and Systems (ICECS 2018) (Bordeaux, France, 09/12/2018–12/12/2018)

17/01/2019

DOI: https://doi.org/10.1109/ICECS.2018.8617951

Résumé

Monolithic 3D

power-supply noise

reliability

Reliable power-delivery network (PDN) design is a major challenge for monolithic 3D (M3D) ICs due to higher power density and current demand per unit area, higher parasitics of interconnects, lower supply voltage, and faster clock. As a first step towards the development of design solutions, we carry out power-supply noise analysis for M3D ICs using electrical and thermal co-simulation. We study the power-supply noise for different PDN designs and analyze design features that impact power-supply noise. This study of power-supply noise motivates further studies on reliable power delivery for M3D ICs.

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Titre: Power-Supply Noise Analysis for Monolithic 3D ICs Using Electrical and Thermal Co-Simulation
Créateurs - sans rôle: Abhishek Koneru - Duke University
Aida Todri-Sanial - Centre National de la Recherche Scientifique
Krishnendu Chakrabarty - Duke University
Détails de publication: 25th IEEE International Conference on Electronics Circuits and Systems (ICECS 2018), pp.217-220
Colloque: 25th IEEE International Conference on Electronics Circuits and Systems (ICECS 2018) (Bordeaux, France, 09/12/2018–12/12/2018)
Identifiants: 9944844709311
Unité académique: Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier - LIRMM
Langue: English
Type de ressource: Conference proceeding
Champs locaux: lirmm-01880158