Résumé
This paper presents a monolithic integration approach of a generic power converter (DC/AC or AC/DC (Fig. 1a)). The integration approach is verified for the case of an H-bridge inverter application through 2D simulations. Experimental characterization results are provided for the common anode three-pole chip and for RC-IGBT structures. The work presented in this paper constitutes a continuation for the work previously presented by the same authors [1][2][3]. The aim of this integration approach is to suppress wire bonds and to have ultra-compact package in order to improve electrical performance as well as reliability of the power modules in medium power applications.