Résumé
In this paper, a behavioral model that includes the influence of etching defects on the sensitivity of MEMS convective accelerometers is presented. Starting from an existing behavioral model, new physically-based expressions have been derived to introduce etching defects in the simulation of thermal conduction in the sensor. In addition, a semi-empirical model has been introduced for thermal convection. Finally, a very good agreement is obtained between the behavioral model and FEM simulations.