Abstract
The interest to develop low cost passive sensors on objects of various forms led us to adapt technological processes of microelectronics on flexible substrate. Passive components deposited on polymer flexible support such as type PET (Polyethylene Terephthalate) or Kapton (R) (Polyimide) are already well-known for example in Radio-Frequency Identification (RFID), strain gauge, humidity sensor, etc. The use of a very economic and ecological substrate such as paper proves much more interesting and still very little explored. However, the brittleness of this material due to moisture and temperature of use constitutes a major technical challenge taking into consideration its potential application in electronics. To use this type of substrate, we set up different processes allowing the packaging of the substrate to be able to undergo all techniques in microelectronic. This has allowed us afterward to realize various devices like inductive coils, RFID tags or interdigital capacitors, using the microelectronic manufacturing processes. We have reached excellent resolutions without any damage.