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Intensity ratio of the doublet signature of excitons bound to 3C-SiC stacking faults in a 4H-SiC matrix
Acte de colloque

Intensity ratio of the doublet signature of excitons bound to 3C-SiC stacking faults in a 4H-SiC matrix

Jean Camassel et Sandrine Juillaguet
SILICON CARBIDE AND RELATED MATERIALS 2004, Vol.483, pp.331-334
5th European Conference on Silicon Carbide and Related Materials (Bologna (ITALY), France, 31/08/2004)
2005

Résumé

4H-SiC 3C stacking faults quantum wells thickness LAYERS
In 4H-SiC, 3C stacking fault (SF) behaves like a finite thickness type U quantum well. As a consequence, it can bind two excitons per well. We show in this work that, as the SF thickness increases, the relative intensity of the two transitions changes. This comes from a change in the wave functions overlap between the electron trapped in the well and the holes trapped neighbouring parts of the 4H-SiC matrix.

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