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Ferroelectric Ceramic Materials for Multilayer Capacitive Substrate used for 3D Power Passive Components Integration
Acte de colloque   Open Access

Ferroelectric Ceramic Materials for Multilayer Capacitive Substrate used for 3D Power Passive Components Integration

Thi Bang Doan, Thierry Lebey, Francois Forest et Thierry A Meynard
CEIDP 2013: EEE Conference on Electrical Insulation and Dielectric Phenomena, pp.1050-1053
CEIDP 2013: EEE Conference on Electrical Insulation and Dielectric Phenomena (Shenzen, China, 2013–23/10/2013)
2013

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