Résumé
In this paper, we evaluate the temperature influence on the vulnerability to single event upsets (SEU) of 6-transistor static random access memory (6T-SRAM) cells and dual interlocked storage cells (DICE). The critical charge (Qcrit, minimum charge capable of generating an SEU) is evaluated for 65nm, 45nm, 32nm and 22nm bulk CMOS technologies and temperatures between -50°C and 150°C. A double exponential signal is used to model the current pulse generated by ionizing particles. SPICE simulations have shown that Qcrit is sensibly reduced by the rise of temperature. Qcrit variations of up to 88.4% and 99.9% have been calculated for 6T-SRAM and DICE cells, respectively.