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Dry Etching of High [Al] AlGaAsSb Compounds Using Cl 2 /N 2 /Ar ICP RIE
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Dry Etching of High [Al] AlGaAsSb Compounds Using Cl 2 /N 2 /Ar ICP RIE

Brice Adelin, Quentin Gaimard, Alexandre Larrue, Aurélie Lecestre, Pascal Dubreuil, Yves Rouillard, Guilhem Boissier, Aurore Vicet, Antoine Monmayrant et Olivier Gauthier-Lafaye
International Conference on Micro and Nano Engineering ( MNE ) 2014 (Lausanne, Switzerland, 22/09/2014–26/09/2014)

Résumé

Deep dry etching of shallow features in high Al content AlGaAsSb can be achieved using Cl2/N2/Archemistries. Good performances are achieved provided that the etching regime (ICP or RIE) is chosen inaccordance with the designed geometry and aspect ratio, and devices with good opto-electricalperformances were fabricated.

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