Design of A Highly Reliable and Low-Power SRAM With Double-Node Upset Recovery for Safety-critical Applications

Aibin Yan; Jing Xiang; Zhengfeng Huang; Tianming Ni; Jie Cui; Patrick Girard; Xiaoqing Wen

doi:10.1109/ITC-Asia58802.2023.10301170

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Design of A Highly Reliable and Low-Power SRAM With Double-Node Upset Recovery for Safety-critical Applications

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Design of A Highly Reliable and Low-Power SRAM With Double-Node Upset Recovery for Safety-critical Applications

Aibin Yan, Jing Xiang, Zhengfeng Huang, Tianming Ni, Jie Cui, Patrick Girard et Xiaoqing Wen

ITC-Asia 2023 - 7th IEEE International Test Conference in Asian, pp.1-6

ITC-Asia 2023 - 7th IEEE International Test Conference in Asian (Matsue, Japan, 12/09/2023–14/09/2023)

2023

DOI: https://doi.org/10.1109/ITC-Asia58802.2023.10301170

Résumé

Radiation

Circuit reliability

Sensitive node

Soft error

Double-node-upset

For high-speed operations, low power consumption and small silicon area, transistors are being scaled aggressively. Meanwhile, circuit reliability is facing greater challenges in advanced technologies. In this paper, a highly reliable and lowpower SRAM with double-node-upset (DNU) recovery, namely HRLP16T, is proposed for safety-critical fields. HRLP16T can recover from single-node-upset (SNU) at all the sensitive nodes, and it has eight node pairs recover from DNUs. Simulationbased evaluation results demonstrate advantages in terms of delay and power consumption over epical existing SRAM cell designs.

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Détails

Titre: Design of A Highly Reliable and Low-Power SRAM With Double-Node Upset Recovery for Safety-critical Applications
Créateurs - sans rôle: Aibin Yan - Anhui University
Jing Xiang - Anhui University
Zhengfeng Huang - Hefei University of Technology
Tianming Ni - Anhui Polytechnic University
Jie Cui - Anhui University
Patrick Girard - Centre National de la Recherche Scientifique
Xiaoqing Wen - Kyushu Institute of Technology
Détails de publication: ITC-Asia 2023 - 7th IEEE International Test Conference in Asian, pp.1-6
Colloque: ITC-Asia 2023 - 7th IEEE International Test Conference in Asian (Matsue, Japan, 12/09/2023–14/09/2023)
Identifiants: 99152231509311
Unité académique: Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier - LIRMM
Langue: English
Type de ressource: Conference proceeding
Champs locaux: lirmm-04241173