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Copper diffusion into silicon substrates through TaN and Ta/TaN multilayer barriers
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Copper diffusion into silicon substrates through TaN and Ta/TaN multilayer barriers

Nicole Fréty, Florent Bernard, Julien Nazon, Joël Sarradin et Jean-Claude Tedenac
TMS 2006 (The Minerals, Metals & Materials Society), 135th Annual Meeting (United States, 12/03/2006)

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