Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology

Jaehyun Lee; Jie Liang; Salvatore Amoroso; Toufik Sadi; Liping Wang; Asen Asenov; Andrew Pender; Dave Reid; Vihar Georgiev; Campbell Millar; Aida Todri-Sanial

doi:10.23919/SISPAD.2017.8085287

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Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology

Acte de colloque

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Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology

Jaehyun Lee, Jie Liang, Salvatore Amoroso, Toufik Sadi, Liping Wang, Asen Asenov, Andrew Pender, Dave Reid, Vihar Georgiev, Campbell Millar, …

International Conference on Simulation of Semiconductor Processes and Devices, pp.153-156

SISPAD: Simulation of Semiconductor Processes and Devices (Kamakura, Japan, 07/09/2017–09/09/2017)

2017

DOI: https://doi.org/10.23919/SISPAD.2017.8085287

Résumé

Density Functional Theory (DFT)

Circuit simulation

Hierarchical models

Interconnects

Carbon nanotubes (CNTs)

Cu-CNT composites

In this study, we suggest a hierarchical model to investigate the electrical performance of carbon nanotube (CNT)- based interconnects. From the density functional theory, we have obtained important physical parameters, which are used in TCAD simulators to obtain the RC netlists. We then use these RC netlists for the circuit-level simulations to optimize interconnect design in VLSI. Also, we have compared various CNT-based interconnects such as single-walled CNTs, multi-walled CNTs, doped CNTs, and Cu-CNT composites in terms of conductivity, ring oscillator delay, and propagation time delay.

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Détails

Titre: Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology
Créateurs - sans rôle: Jaehyun Lee - University of Glasgow
Jie Liang - Laboratoire d'Informatique, de Robotique et de Microélectronique de Montpellier
Salvatore Amoroso - Synopsys Inc.
Toufik Sadi - Aalto University
Liping Wang - Synopsys Inc.
Asen Asenov - University of Glasgow
Andrew Pender - Synopsys Inc.
Dave Reid - Synopsys Inc.
Vihar Georgiev - University of Glasgow
Campbell Millar - Synopsys Inc.
Aida Todri-Sanial - Université de Montpellier
Détails de publication: International Conference on Simulation of Semiconductor Processes and Devices, pp.153-156
Colloque: SISPAD: Simulation of Semiconductor Processes and Devices (Kamakura, Japan, 07/09/2017–09/09/2017)
Identifiants: 9934977609311
Unité académique: Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier - LIRMM
Langue: English
Type de ressource: Conference proceeding
Champs locaux: lirmm-01795803