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Assessment of Fallouts of the Thermal Step Method for measuring Space Charge in Liquid Dielectrics
Acte de colloque   Open Access

Assessment of Fallouts of the Thermal Step Method for measuring Space Charge in Liquid Dielectrics

Xavier Sidambarompoulé, Jean-Charles Laurentie, Petru Notingher, Thierry Paillat et Paul Leblanc
2018 IEEE 2nd International Conference on Dielectrics (ICD)
2018 IEEE 2nd International Conference on Dielectrics (ICD)
IEEE 2nd International Conference On Dielectrics (ICD 2018) (Budapest, Hungary, 01/07/2018–05/07/2018)

Résumé

liquid dielectrics space charges thermal step method electrical double layer
This focuses on studying the applicability of the Thermal Step Method (TSM) in liquid dielectrics. The TSM is widely used on solid dielectrics, in which thermal conduction prevails. Experimental results and numerical simulations are employed to study the use of the TSM in dielectric liquids, particularly with respect to liquid convection and permittivity variation with temperature.

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