Résumé
Metallic carbon nanotubes (CNTs) and Cu- CNT composites have been regarded for years as one of the promising candidates for the future interconnects to replace Cu. Due to CNTs’ small effective mass and 1-D structure, and strong C-C bonding, they have a very high ampacity, a large mean free path (λ), and excellent mechanical properties [1]. In this work, we have investigated the transport properties of CNT interconnects based on density functional theory (DFT) and compact model analysis. We also propose a hierarchical model to connect the DFT with circuit-level simulations.