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Towards Package Opening Detection at Power-up by Monitoring Thermal Dissipation
Chapitre d'ouvrage

Towards Package Opening Detection at Power-up by Monitoring Thermal Dissipation

Julien Toulemont, Geoffrey Chancel, Frédérick Mailly, Philippe Maurine et Pascal Nouet
Constructive Approaches for Security Analysis and Design of Embedded Systems, pp.410-428
Lecture Notes in Computer Science, Springer Nature Switzerland
2026
DOI: https://doi.org/10.1007/978-3-032-01405-4_17

Résumé

countermeasure fault attacks hardware reverse-engineering Security thermal dissipation monitoring
Among the various threats to secure ICs, many are semi-invasive in the sense that their application requires the removal of the package to gain access to either the front or back of the target IC. Despite this stringent application requirements, little attention is paid to embedded techniques aiming at checking the package’s integrity. This paper explores the feasibility of verifying the package integrity of microcontrollers by examining their thermal dissipation capability.

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