- Title
- Electromigration Alleviation Techniques for 3D Integrated Circuits
- Creators - without role
- Yuanqing ChengAida Todri-Sanial - Smart Integrated Electronic SystemsAlberto Bosio - Test and dEpendability of microelectronic integrated SysTemsLuigi Dilillo - Test and dEpendability of microelectronic integrated SysTemsPatrick Girard - Test and dEpendability of microelectronic integrated SysTemsArnaud Virazel - Test and dEpendability of microelectronic integrated SysTemsPascal VivetMarc Belleville
- Contributors - without role
- Chao Wang
- Publication Details
- High Performance Computing for Big Data: Methodologies and Applications, pp.37-58
- Identifiers
- 9943146809311
- Academic Unit
- Laboratoire d'Informatique de Robotique et de Microélectronique de Mtp - LIRMM
- Language
- English
- Resource Type
- Book chapter
- Local Fields
- lirmm-01800220
Book chapter
Electromigration Alleviation Techniques for 3D Integrated Circuits
High Performance Computing for Big Data: Methodologies and Applications, pp.37-58
10/10/2017
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